
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/20/13
TVS Diode Arrays (SPA
®
Diodes)
Low Capacitance ESD Protection - SP3003 Series
Package Dimensions — SC70-6
D
A2
A
A1
C
L
E
HE
2
1
3
6
5
4
e
e
B
Package SC70-6
Pins 6
JEDEC MO-203
Millimeters Inches
Min Max Min Max
A 0.80 1. 10 0.031 0.043
A1 0.00 0.10 0.000 0.004
A2 0.70 1. 0 0 0.028 0.039
B 0.15 0.30 0.006 0.012
c 0.08 0.25 0.003 0.010
D 1.85 2.25 0.073 0.089
E 1. 15 1.35 0.045 0.053
e 0.65 BSC 0.026 BSC
HE 2.00 2.40 0.079 0.094
L 0.26 0.46 0.010 0.018
Recommended Solder Pad Layout
Package Dimensions — SC70-5
D
A2
A
A1
C
L
E
HE
2
1
3
6
5
not used
4
e
e
B
Package SC70-5
Pins 5
JEDEC MO-203
Millimeters Inches
Min Max Min Max
A 0.80 1. 10 0.031 0.043
A1 0.00 0.10 0.000 0.004
A2 0.70 1. 0 0 0.028 0.039
B 0.15 0.30 0.006 0.012
c 0.08 0.25 0.003 0.010
D 1.85 2.25 0.073 0.089
E 1. 15 1.35 0.045 0.053
e 0.65 BSC 0.026 BSC
HE 2.00 2.40 0.079 0.094
L 0.26 0.46 0.010 0.018
Recommended Solder Pad Layout
Package Dimensions — SOT553
Package SOT 553
Pins 5
Millimeters Inches
Min Max Min Max
A 0.50 0.60 0.020 0.024
B 0.17 0.27 0.007 0.011
c 0.08 0.18 0.003 0.007
D 1.50 1.70 0.059 0.067
E 1. 10 1.30 0.043 0.051
e 0.50 BSC 0.020 BSC
L 0.10 0.30 0.004 0.012
HE 1.50 1.70 0.059 0.067
c
HE
L
A
D
6
4
2
3
E
e
B
5
(not used)
Recommended
Solder Pad Layout
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