
Transient Voltage Suppression Diodes
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/20/14
Surface Mount – 500W > SACB series
SACB series is designed specifically to protect sensitive
electronic equipment from voltage transients induced by
lightning and other transient voltage events.
Description
TVS devices are ideal for the protection of I/O Interfaces,
V
CC
bus and other vulnerable circuits used in Telecom,
Computer, Industrial and Consumer electronic applications.
Applications
Features
Maximum Ratings and Thermal Characteristics
(T
A
=25°C unless otherwise noted)
• For surface mounted
applications in order to
optimize board space
• Low prole package
• Built-in strain relief
• Typical failure mode is
short from over-specied
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
15kV(Air), 8kV (Contact)
• ESD protection of data
lines in accordance with
IEC 61000-4-2 (IEC801-2)
• EFT protection of data
lines in accordance with
IEC 61000-4-4 (IEC801-4)
•
V
BR
@T
J
= V
BR
@25°C × (1+αT
x (T
J
- 25))
(αT: Temperature Coefcient)
• Glass passivated chip
junction
• 500W peak pulse power
capability at 10/1000μs
waveform, repetition rate
(duty cycles):0.01%
• Fast response time:
typically less than 1.0ps
from 0V to BV min
• Excellent clamping
capability
• Low incremental surge
resistance
• High temperature
soldering guaranteed:
260°C/40 seconds at
terminals
• Plastic package has
underwriters laboratory
ammability 94V-O
• Meet MSL level1, per
J-STD-020, LF maximum
peak of 260°C
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
Parameter Symbol Value Unit
Peak Pulse Power Dissipation at
ta=25°C by 10/1000μs Waveform
(g.1)( Note 1)
P
PPM
500 W
Power Dissipation on Innite Heat
Sink at T
L
=50ºC
P
M(AV)
3.0 W
Peak Pulse Power Dissipation at
Ta=25ºC by 10/1000μs Waveform
(Fig. 3) (Note 1)
I
PPM
See
Table 1
Amps
Operating Junction and Storage
Temperature Range
T
J
, T
STG
-55 to 150 °C
Typical Thermal Resistance Junction
to Lead
R
uJL
30 °C/W
Typical Thermal Resistance Junction
to Ambient
R
uJA
120 °C/W
Note:
1. Non-repetitive current pulse , per Fig. 3 and derated above T
A
= 25°C per Fig. 2.
Agency Approvals
AGENCY AGENCY FILE NUMBER
E230531
RoHS
SACB Series
Uni-directional
Additional Information
Datasheet
Samples
Resources
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