
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/23/14
Surface Mount Fuses
Nano
2®
> 600VDC > Fast-Acting 485 Series
Average Time Current CurvesTemperature Rerating Curve
TIME IN SECONDS
CURRENT IN AMPERES
0.001
0.01
0.1
1
10
100
0.1 1 10 100 100
A
.5
A
2.5A
3.15A
Reflow Condition Pb–FreeAssembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (Min to Max) (t
s
) 60–180ses
Average Ramp-up Rate (Liquidus Temp
(T
L
) to peak)
5°C/secondmax.
T
S(max)
to T
L
- Ramp-up Rate 5°C/secondmax.
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60–150seconds
Peak Temperature (T
P
) 260
+0/–5
°C
Time within 5°C of actual peak
Temperature (t
p
)
20–40seconds
Ramp-down Rate 5°C/secondmax.
Time 25°C to peak Temperature (T
P
) 8minutesmax.
Do not exceed 260°C
Soldering Parameters - Reflow Soldering
Time
Temperature
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
T
L
to T
P
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