Littelfuse 1210L Series Manual de usuario descargar pdf (Pagina 3)

POLY-FUSE

Resettable PTCs

Speciﬁcations are subject to change without notice.

Revised: 11/05/13

1210L Series

Surface Mount > 1210L Series

Environmental Speciﬁcations

Soldering Parameters

Condition Reﬂow

Peak Temp/ Duration Time 260°C / 10 Sec

Time above liquids (TAL) 220°C 60 Sec ~ 100 Sec

Preheat 120°C~ 180°C 50 Sec ~ 150 Sec

Storage Condition 0°C~35°C,

70%RH

• Recommended reow methods: IR, vapor phase oven, hot air

oven, N

environment for lead–free

• Recommended maximum paste thickness is 0.25mm (0.010 inch)

• Devices can be cleaned using standard industry methods and

solvents.

Note: If reow temperatures exceed the recommended prole,

devices may not meet the performance requirements.

Operating/Storage

Temperature

-40°C to +85°C

Maximum Device Surface

Temperature in Tripped

State

125°C

Passive Aging

+85°C, 1000 hours

-/+5% typical resistance change

Humidity Aging

+85°C, 85, R.H.,1000 hours

-/+5% typical resistance change

Thermal Shock

MIL–STD–202, Method 107G

+85°C/-40°C, 20 times

-30% typical resistance change

Solvent Resistance

MIL–STD–202, Method 215

No change

Vibration

MIL–STD–883C, Method 2007.1,

Condition A

No change

Moisture Level Sensitivity Level 1, J–STD–020C

Physical Speciﬁcations

Terminal Material

Solder-Plated Copper (Solder Material:

Matte Tin (Sn))

Lead Solderability

Meets EIA Specication RS186-9E,

ANSI/J-STD-002 Category 3.

Preheating

120

180

220

260

60 to 100

Temperature (°C)

Soldering Cooling

120

50 to 150

Time(s)

1 2 3 4 5 6

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